Brominated Epoxy Resins CAS 68928-70-1

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Model: MOS68928-70-1
Brand Name: MOSINTER
CAS No.: 68928-70-1
Brand: MOSINTER
Molecular formula: C36H32Br8O6
Appearance: Colorless liquid
Molecular mass: 1199.8677
EEW(g/eq): 420-450
HyCl (ppm): 200-500
Solid Content(wt%): 79-81
Viscosity(Brookfield cps): 1200-1800
Color(Gardner): 1max
Gel Time(sec): 142-152

Brominated Epoxy Resins (CAS: 68928-70-1) is Bisphenol A type liquid epoxy resin.

 

Brominated Epoxy Resins Molecular structure

ITEM STANDARD RESULT
Appearance Colorless liquid Pass’
EEW(g/eq) 420-450 436
HyCl (ppm) 200-500 257
Solid   Content(wt%) 79-81 80.33
Viscosity(Brookfield cps) 1200-1800 1475
Color(Gardner) 1max 0.3
Gel   Time(sec) 142-152 151

This resin has the consistency of honey. The epoxide group on the end of these molecules serves as 

the reactive site for crosslinking in these thermoset polymers. 

The chemical chosen to react with these epoxides is referred to as the curing agent, and it typically 

has active hydrogen attached to nitrogen, oxygen, or sulfur. Amine curing agents are the most common 

and can be primary or secondary, aliphatic or aromatic, or cycloaliphatic. The amines typically have 

greater than three reactive sites per molecule tat facilitate the formation of a three-dimensional polymer network when mixed with the epoxy resin 

Composite is a material reinforced by fibers or other materials with a discernable aspect ratio of length to thickness. The fibers are primarily glass or carbon but aramid, boron and other organic and 

natural fibers are also used. Polymers used in composites are typically thermosets, and their purpose is to transfer the load or stresses to the fiber reinforcement in order to take advantage of the 

strength and stiffness (modulus) of the fibers. Typical fiber volume in this application is approximately 

70%. 

Applications for composites cover a broad spectrum from do-it-yourself patching and hobby kits cured at 

room temperature to advanced military and aerospace components cured at high temperatures. Performance 

and processing requirements are as diverse as the applications, so a “systems” approach must be taken when 

selecting the resin and curing agent for the specific application. 

Where the molecular structure of a polymer compound containing epoxy groups collectively referred to as an epoxy resin. After curing epoxy resin has excellent physical and chemical properties, its surface of the metal and non-metallic material has excellent adhesion strength, good dielectric properties, variable set small shrinkage, good dimensional stability, high hardness, flexibility better, alkali and most of the solvent stability, which is widely used in various sectors of national defense, national economy, for pouring, dipping, laminating materials, adhesives, coatings and other purposes.

Epoxy short EP, is two or more epoxy groups in the molecular structure of the resin contained in general. Whether long or short molecules, both ends of the keys are basically an epoxy group, an epoxy group and a functionality of 2, and the curing agent after the crosslinking, a three-dimensional network structure can be formed, so that the epoxy resin is a Body polymers. According to the degree of polymerization can be divided into liquid or solid. Since an epoxy group is a three-membered ring, such a ring is easy ternary ring opening and has a strong reactivity, many features are the resulting epoxy resin. The most important species is the epoxy resin of epichlorohydrin and bisphenol A condensation from bisphenol A glycidyl ether type epoxy resin; In addition, the ring-containing ethylenic compound prepared by reacting epoxy resins.